Early Registration Deadline: May 2, 2022
#FCMN2022
Facebook
FCMN_2022_logo_207x46FCMN_2022_logo_207x46
logo_avs_sponsored140x55
  • Overview
    • AVS Code of Conduct
    • Committee
    • FCMN 2022 Health & Safety Plan
  • Abstracts
  • Hotel/Travel
    • Things To Do
  • Sponsors/Exhibitors
  • Schedule
    • Schedule (PDF)
    • Tutorial Session I – Machine Learning
    • Tutorial Session II – Metrology Techniques
    • Presentation & Poster Guidelines
  • Register

Schedule

Technical Program

The 2022 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN) will be held at the Monterey Marriott in Monterey, CA, June 20-23, 2022.

The FCMN will bring together scientists and engineers interested in all aspects of the characterization technology needed for nanoelectronic materials and device research, development, integration, and manufacturing. All approaches are welcome: chemical, physical, electrical, magnetic, optical, in situ, and real-time control and monitoring. The semiconductor industry is evolving rapidly:  the conference will highlight major issues and provide critical reviews of important materials and structure characterization and nearline/inline metrology methods, including hardware, data analysis, and AI and machine learning, as the industry both extends the technology deep into the nanoscale and increases the diversity of devices and systems.

The conference consists of formal invited presentation sessions and poster sessions for contributed papers. The poster papers cover new developments in materials and structure characterization/metrology down to the nanoscale. The conference began in 1995, and this meeting is the 13th in the series.

Download Schedule

DOWNLOAD SCHEDULE

Tutorial Sessions

The FCMN 2022 organizers have scheduled two (2) limited seating tutorials. Both will take place on Monday, June 20, 2022. The first on Machine Learning will be presented by Bryan Barnes with NIST and Ali Masbah from UC Berkeley; and the second will focus on Metrology Techniques and will be presented by Paul van der Heide with Imec and Alain Diebold from CNSE, Suny Polytechnic Institute.

Advance registration is required and space is limited to 20 people per tutorial. Registration will be on a first-come, first-served basis.

Tutorial Session I: Machine Learning

Time:  2:00-4:00 p.m.
Cost: $50

Machine Learning for Metrology
Presenters:
  Bryan Barnes, NIST and Ali Mesbah, UC Berkeley

Tutorial Session 2: Metrology Techniques

Time:  4:00-6:00 p.m.
Cost: $50

2A. Materials Characterization for Semiconductor Manufacturing
Presenter:
Paul van der Heide, Imec

2B. In Line Metrology for Semiconductor Manufacturing
Presenter:
Alain Diebold, CNSE, SUNY Polytechnic Institute

Invited Speakers & Biographies

  • Ofer Adan, Applied Materials
  • Andy Antonelli, ONTO
  • Jean-Paul Barnes, CEA-Leti
  • Tomek Brozek, PDF Solutions
  • Umberto Celano
  • David Cooper, CEA-Leti
  • David Fried, Lam Research
  • Arosha Goonesekera, LaserTec Inc.
  • Brian Gorman, Colorado School of Mines
  • Sang Hyun Han, Nova
  • Bjoern Hansson, Excillum
  • Peter Hopkins, NIST
  • Dan Hutcheson, TechInsights
  • Rajiv Joshi, IBM
  • Vimal Kamineni, PsiQuantum
  • Joseph Kline, NIST
  • Sylwia Kozdra, Łukasiewicz – IMiF
  • Kristina Kutukova, Fraunhofer IKTS
  • David Larson, Cameca Instruments, Inc.
  • June Lau, NIST
  • Jon Madsen, KLA Corporation
  • Christina Porter, ASML
  • Mathieu Munsch, Qnami
  • Thomas Nuytten, Imec
  • Olivier Renault, CEA-Leti
  • Yu-Tsun Shao, Cornell University
  • Marcin Strojwas, PDF Solutions
  • David Tien, ThermoFisher
  • Paul van der Heide, Imec
  • Juliette van der Meer, Bruker
  • Jeffrey Welser, IBM
  • Yalin Xiong, KLA-Tencor
  • WenBing Yun, Sigray
Ofer Adan is the Head of Patterning Control Technology at Applied Materials. Adan has held various roles, leading solutions in metrology inspection and process control since 2001. Adan chaired SPIE Advanced Lithography’s Metrology Inspection and Process Control conference. A steering committee member in the FCMN conference. Adan has been teaching a course on Advanced Concepts in Metrology Toolset Stability and Matching at SPIE. He also has several patents including the first patent on using high energy for SEM Overlay, and over 50 publications on metrology, inspection, process control, failure analysis, and fracture. Adan was awarded several best paper awards at various conferences among them the SPIE Diana Nyyssonen Memorial Award. Adan received an M.Sc. degree in electronic materials engineering from Ben Gurion University where he developed a failure criterion for crack propagation in a re-entrant angle under thermal loading and applied it to improve reliability of interfaces between interconnects and passivation layers in CMOS imaging devices.
Andy Antonelli graduated Summa Cum Laude, First in Class with a B.S. in physics from Davidson College in Davidson, NC in 1995 and later received a MS and Ph.D. in physics from Brown University in Providence, RI in 1997 and 2001, respectively. He started working in the semiconductor industry with IBM, Intel, and Rudolph Technologies before leaving graduate school but started his professional career at Intel in the Portland Technology Group. He later moved on to Novellus Systems, Lam Research, and Nanometrics which merged with Rudolph Technologies to form Onto Innovation. He has made contributions to metrology, deposition process technology, and process integration including being one of the founding architects of the Rudolph MetaPULSE™ technology and the principal architect of the Onto Aspect™ technology, an innovator in low-k dielectric and hardmask materials and processing, and novel plasma sources. He is currently Senior Director of Research & Development and Fellow at Onto Innovation and architects novel metrology hardware and software. He has 35 issued U.S. patents, has written 65 articles and one book, and is a frequent speaker at international conferences.
Tomasz Brozek received M.S. EE degree and Ph.D. degree in Physics from Institute of Semiconductors, Ukrainian Academy of Sciences in Kiev. He started his career as an Assistant Professor and lead research projects in physics and technology of MOS devices at Warsaw University of Technology, Poland and at University of California, Los Angeles. Dr. Brozek has been with PDF Solutions since 2000 and currently holds an Engagement Director and Senior Technical Fellow position, with extensive experience in technology development, FEOL/MOL/BEOL integration, transistor and process characterization, reliability and yield improvement. He has served as Engagement Manager and led several successful PDF yield ramp projects in the past. He has been working on projects with advanced CMOS (down to 5nm node), NVM FLASH, MRAM, PCM, NAND, DRAM, MOS Image Sensors. Before joining PDF Solutions he was with Motorola, working on device characterization, charging damage, process assessment, and reliability support for technology development and transfer of Logic, BiCMOS, and eFlash technologies. Dr. Brozek has published almost 100 technical papers and conference presentation, and holds numerous patents. He is also chairing a Technical Committee for Semiconductor Manufacturing of IEEE Electron Device Society.
Umberto Celano is a Principal Member of Technical Staff with imec (Belgium) and Asst. Professor at the University of Twente (The Netherlands), with expertise in materials analysis for semiconductor technology, device physics and nanoscale functional materials. He has an electrical engineer background and a Master’s in nanoelectronics. He received his Ph.D. in Physics from the University of Leuven – KU Leuven (Belgium) in 2015, working to establish a novel three-dimensional nanoscale imaging technique that combines sensing with sub-nm material removal to study materials in confined volumes. Currently, Dr. Celano’s research interests encompass nanoelectronics, nanophotonic, functional materials and VLSI materials analysis. In these areas, he conducted research in various institutions including KU Leuven, Osaka University and Stanford University.
David Cooper obtained his Ph.d. from the University of Cambridge in the subject of dopant profiling by off-axis electron holography. He has since worked at CEA LETI developing new techniques to anticipate the future needs of the semiconductor industry and currently holds the post Senior Staff Scientist. Between 2012 and 2018, David was the holder of a ERC starting grant which focused on the optimization of electron holography and in-situ methods. He currently works on most TEM based techniques and is interested in correlation between TEM and other complimentary methods. He has published more than 150 peer reviewed papers.
David M. Fried is Vice President of Computational Products at Lam Research. He is responsible for the company’s strategic direction and implementation of software products and algorithms for predictive process modeling and process control. He joined Lam Research in 2017 as a part of Lam’s acquisition of Coventor, where he served as Chief Technology Officer (CTO) for five years. At Coventor, he also led the execution of technology strategy for technology platforms, partnerships, and external relationships. David is a well-respected technologist in the semiconductor industry. He has over 60 patents to his credit and a notable 14-year career with IBM, where he held leadership positions in successive process generations from 65-nanometer through 22-nanometer for IBM’s Systems and Technology Group. His expertise touches upon areas such as Silicon-on-Insulator (SOI), FinFETs, memory scaling, strained silicon, and process variability. David now lives in Northern California with his wife and two daughters. He spends much of his free time with family, cheering at soccer and lacrosse games. David loves to sail, racing a J/70 (7.0m one-design sailboat) competitively, and cruising in Monterey Bay. He also enjoys cycling, skiing, and traveling.
Arosha W. Goonesekera received his Ph. D in Physics from the University of Nebraska-Lincoln in 1998. After a postdoctoral position at Stanford University, he moved to the semiconductor industry in the year 2000. Arosha started his carrier with wafer metrology tool developments for thin-film measurement involving ellipsometry and reflectometry. Then, he moved to the photomask industry with a focus on application and algorithm development in defect detections on reticles. Over the past twelve years, Arosha has worked at leading semiconductor tool manufacturing and photomask manufacturing companies as a photomask inspection tool applications developer and an end-user overlooking all types of photomask defect detection platforms. Also, during this time he engaged in application development for printability verification tools. He has contributed to several key publications that address the algorithm and detection strategy developments for the latest technology node reticles. Currently, Arosha manages projects related to defect detection strategy development on Actinic patterned mask inspection system at Lasertec Inc.
Sang Hyun Han is Nova Ltd.’s Vice President of strategic marketing defining product strategy, strategy for customer engagement, and leading regional marketing team. Before joining Nova Ltd., Sang Hyun had previously held several positions, serving as Product Marketing & Technical Director at KLA from 2008 to 2019. Prior to KLA, Sang Hyun also worked for several semiconductor chip makers as Technical Director of process integration & thin film groups from 1993 to 2008. Sang Hyun earned a Ph.D. in materials science from Iowa State University in the U.S. (1992), and an M.S. in metallurgical engineering from Seoul National University in South Korea (1985), and a B.S. in metallurgical engineering from Hanyang University in South Korea (1983).
Björn Hansson has been working with advanced X-ray sources at Excillum AB since 2011, serving as Director of Sales and Marketing, CEO and now CTO & Deputy CEO. Prior to Excillum AB, Björn was involved in early development of laser plasma sources for EUV lithography at the Royal Institute of Technology in Stockholm, as a Co-Founder of Innolite AB and finally as a Senior Scientist at Cymer, Inc. (now ASML). He holds a Ph.D. in applied physics from KTH Royal Institute of Technology, Stockholm.
Peter Hopkins joined the Superconductive Electronics Group of the National Institute of Standards and Technology in Boulder, CO, in 2014. He has been head of the Flux Quantum Electronics Project since 2015, researching the design, fabrication and testing of superconductor electronics for energy-efficient computing, radio frequency waveform synthesis, and scalable cryogenic quantum computing. His team has also provided test and evaluation support for IARPA’s Cryogenic Computing Complexity (C3) program to develop conventional superconducting computing and IARPA’s SuperTools program, which is developing electronic design automation software tools for superconducting electronics. Prior to working at NIST, Dr. Hopkins spent 19 years in the data storage industry where he productized hard-disk drives and solid-state drives for Quantum, Seagate, and Micron.
G. Dan Hutcheson is Vice Chair of TechInsights Inc. He is a recognized authority on the semiconductor industry, winning SEMI’s Sales and Marketing Excellence Award[1] in 2012 for “empowering executives with tremendous strategic and tactical marketing value” through his e-letter, The Chip Insider®; his book Maxims of Hi-Tech, and his many interviews of executives. As some industry leaders have said, “He is the marketing voice and expert for the industry.” “Dan has methodically captured the essence of the industry and produced it in such a way for all to benefit … He has been such an integral part of the industry for so long, it is difficult to imagine the industry without his contributions.” Dan’s public work on the industry has often focused on challenging predictions of the demise of Moore’s Law that date back decades by demonstrating how doomsayers have been outpaced by emergent behavior through the innate ability of technologists to innovate. This has included invited articles for Scientific American, the SIA, and the Plenary at the SPIE Advanced Lithography Conference

[1] Formerly SEMI’s Bob Graham Award

Rajiv V. Joshi is a Research Staff Member and Key Technical Lead at T. J. Watson Research Center, IBM. He received his B.Tech I.I.T (Bombay, India), M.S (M.I.T) and Dr. Eng. Sc. (Columbia University). He has led successfully predictive failure analytic techniques for yield prediction and also the technology-driven SRAM at IBM Server Group. His statistical techniques are tailored for machine learning and AI . He developed novel memory designs which are universally accepted. He commercialized these techniques. He received 3 Outstanding Technical Achievement (OTAs), 3 highest Corporate Patent Portfolio awards for licensing contributions, holds 62 invention plateaus and has over 260 U.S. patents and over 400 including international patents. He has authored and co-authored over 210 papers. He has given over 50 invited/keynote talks and given several Seminars. He received NY IP Law association “Inventor of the year” award in February 2020. He was awarded prestigious IEEE Daniel Noble award fin 2018 for contributions to predictive analytics, circuits and technology. He received Industrial Pioneer award 2014 from IEEE Circuits and Systems society. He received the Best Editor Award from IEEE TVLSI journal. He was inducted into New Jersey Inventor Hall of Fame in Aug 2014. He is a recipient of 2013 IEEE CAS Industrial Pioneer award and 2013 Mehboob Khan Award from Semiconductor Research Corporation. He won this award again in 2020 for AI initiatives in BRIC program funded by SRC. He won several best paper awards from ISSCC 1992, ICCAD 2012, ISQED, VMIC. He is a member of IBM Academy of Technology and a Master Inventor. He serves on the Board of Governors for IEEE CAS as Industrial Liaison. He served as a Distinguished Lecturer for IEEE CAS, CEDA and EDS society. He is IEEE, ISQED and World Technology Network Fellow and Distinguished Alumnus of IIT Bombay. He serves as an Associate Editor of TVLSI and TCAS I journals. He has served on committees of conferences such as DAC 2019, AICAS 2019, ISCAS, ISLPED (Int. Symposium Low Power Electronic Design), IEEE VLSI design, IEEE CICC, IEEE Int. SOI conference, ISQED and Advanced Metallization. He is an Industry Liaison for universities as a part of the Semiconductor Research Corporation and IEEE CAS society.
Vimal Kamineni is the Sr. Director of Foundry Engineering at PsiQuantum, where he joined in 2018. Powered by breakthroughs in silicon photonics and quantum architecture, PsiQuantum is on course to build the world’s first commercially useful general-purpose quantum computer to solve some of the world’s most important challenges. At PsiQuantum, Dr. Kamineni leads the semiconductor development required to build quantum chips with novel materials and devices for quantum computing. He leads a diverse team of process, equipment, integration, design enablement, characterization, and metrology engineers to meet performance, reliability, and yield requirements of a scalable quantum computer. Dr. Kamineni holds a Ph.D. from the College of Nanoscale Science and Engineering (Albany, NY) in Nanoscale Science with a Thesis titled “Electron-Phonon Interactions and Quantum Confinement Effects on Optical Transitions in Nanoscale Silicon Films”. After his graduation, he joined GLOBALFOUNDRIES technology research organization in 2011 and was assigned to the IBM Alliance as a Research Partner. From 2014 to 2018, he led a process and integration team to evaluate cobalt as a replacement for tungsten contacts. He championed the basic materials understanding of cobalt and the integration challenges for a CMOS technology insertion. Dr. Kamineni was an active SRC liaison for GLOBALFOUNDRIES and was engaged in university research projects mentoring students. He has authored over 50 scientific publications, 47 issued patents and co-authored a book chapter in “Ellipsometry at the Nanoscale”.
Joseph Kline leads the Metrology for Nanolithography project at NIST. He received his Ph.D. in Materials Science and Engineering at Stanford University. He has published more than 100 articles, given more than 50 invited presentations, and has received awards including the Presidential Early Career Award for Science and Engineering, the Department of Commerce Gold Award, and the Arthur S. Flemming Award.
Kristina Kutukova is an X-ray application specialist at deepXscan GmbH in Dresden. Her responsibilities include development and demonstration of a broad range applications of high-resolution X-ray imaging. Kristina Kutukova received her double Master degree in Non-Destructive Testing at Dresden International University, Germany, and Tomsk Polytechnic University, Russia, in 2016. Her PhD thesis was targeted on the mechanical robustness of microelectronic products, studying microcrack propagation in on-chip interconnect stacks. More than 5 years she was a research associate in the Department of Microelectronic Materials and Nano-scale Analysis at Fraunhofer Institute for Ceramic Technologies and Systems Dresden, Germany. Her field of research was a high-resolution X-ray imaging, in particular design, development and integration of in-situ and operando setups into X-ray microscopy and nano-XCT systems for a microelectronics and battery applications. Kristina Kutukova is Member of the Scientific Committee of the European Nanoanalysis Symposium, annually held within the Fall Meeting of the European Materials Research Society (E-MRS).
David J. Larson is currently Director of Scientific Marketing for CAMECA Instruments Inc.. He received his Ph.D. in Materials Science from the University of Wisconsin – Madison.  He is the past- President (2014-2021) of the International Field Emission Society. He previously held positions at Seagate Technology, Oak Ridge National Laboratory, and the University of Oxford.  He is a Microscopy Society of America Fellow and his other awards include the Burton Metal (Microscopy Society of America), Honorary Staff (University of Sydney), the Cosslett Award (Microbeam Analysis Society), Visiting Scholar (Corpus Christi College, University of Oxford), Honorary Staff (University of Alabama), Industrial Fellow (University of Wisconsin), President’s Award and Outstanding Recent Alumnus Award (University of Wisconsin – Eau Claire), and the Innovation in Materials Characterisation Award (Materials Research Society).  He has approximately 300 publications, holds eight patents, and may be reached at david.larson@ametek.com.
Jon Madsen has been with KLA for over 16 years and manages the KLA metrology product portfolio including Overlay, Films, Optical CD, CD-SAXS, SensArray (in-situ metrology), MRAM metrology, and Resistivity and Implant metrology. Jon has held a variety of leadership positions in general management, technology development, engineering, program management and semiconductor process development. Jon earned his Master’s degree in chemical engineering and Bachelor’s degree in Chemistry from the University of Illinois.
Mathieu Munsch is the Co-founder and CEO of Qnami. He holds an engineering degree from the ENS Grenoble INP and a Ph.D. in Quantum Mechanics from the University Grenoble Alpes. He worked 10 years as a Researcher developing new sources of quantum light and lasers. He is the author of > 15 publications in high profile papers such as Nature and the Physical Review. In 2017, Mathieu founded Qnami AG, a pioneer company in the quantum technology industry. Today Qnami is a leader in the emerging market of quantum sensing and metrology. Mathieu is actively in the creation of a European quantum ecosystem and training of a new European workforce for quantum applications.
Thomas Nuytten received a Ph.D. in physics from the KU Leuven in 2009 and subsequently worked as a Postdoctoral Researcher in the field of semiconductor nanostructures and energy conversion systems. In 2013, he joined imec in Leuven where his main interests include spectroscopic characterization of next-generation semiconductor technologies and EUV ultrafast phenomena. As Principal Member of Technical Staff he is responsible for the Raman and photoluminescence service and research at imec and the project management of the EUV laboratory AttoLab.
Christina Porter has been a member of the research department at ASML since the beginning of 2019. She is a project leader working on next generation, scatterometry based metrology solutions. Christina has a Master’s degree in electrical engineering from Princeton University and a Ph.D. in physics from the University of Colorado at Boulder, where she worked in the research group of Margaret Murnane and Henry Kapteyn. Her dissertation was on complex, EUV imaging reflectometry: pairing tabletop, high harmonic generation EUV light sources with angle resolved ptychography to achieve non-destructive, quantitative 3D imaging in reflection geometries. She joined ASML with the dream of carrying similar technology through to its real world application in the semiconductor industry, where increasingly 3D nanoscale devices require revolutionary metrology techniques to keep up with Moore’s law.
Olivier Renault is Team Leader of the Surface Analysis group at the Nanocharacterization Platform of CEA-Leti since 2006. His activities deal with photoemission techniques and analytical methods for device technology and related materials, including X-ray photoelectron spectroscopy (XPS), hard X-ray photoelectron spectroscopy (HAXPES) and photoemission electron microscopy (PEEM) for elemental, chemical, work function and band structure imaging, with at times the use of synchrotron radiation. He joined Leti in 2000 after a Ph.D. degree from Grenoble Polytechnical Engineering Institute and a Post-Doctoral stay at the University of Oxford, UK (Physical Electronics Group, Department of Engineering Science). Since 2015 he has been involved in the organization of events related to photoemission, such as the Focus Topic “Novel Trends in Light Sources” at the Annual Symposium of the American Vacuum Society, and the Photoelectron Spectroscopy Annual Workshop of the French Vacuum Society. He is also, since 2020, Chief Scientist of the Metrology and Physical Characterization Department at LETI.
Yu-Tsun Shao’s primary research focuses on understanding the interplay between spin, lattice, polarization, and charge in quantum materials by developing and employing novel electron microscopy techniques, specifically four-dimensional scanning transmission electron microscopy (4D-STEM). Specifically, he applies 4D-STEM to (multi-)ferroic crystals to study their local polar/magnetic order, strain, and chiralities during topological phase transitions. Yu-Tsun received his Ph.D. in Materials Science and Engineering at the University of Illinois at Urbana-Champaign in 2018 and is currently a Postdoctoral Researcher in Professor David Muller’s group at Cornell University. He is a recipient of the Robert P. Apkarian Postdoctoral Scholar Award (2021) and Presidential Student Award (2016) of the Microscopy Society of America, and the Ludo Frevel Crystallography Scholarship Award of the International Centre for Diffraction Data (2016).
Marcin Strojwas received his B.S. and MEng. in Electrical Engineering and Computer Science from MIT. He received his Ph.D. from the Harvard Business School / Harvard University Doctoral Program in Information Technology and Management where his thesis topic was “Vertical Integration In The Semiconductor Industry”. His publications include the Harvard Business School Case Study: “Taiwan Semiconductor Manufacturing Company: Building a Platform for Distributed Innovation” (Co-authored with Prof. Marco Iansiti) and RAND Journal of economics article “The Design of Patent Pools: The Determinants of Licensing Rules” (Co-authored with Prof. Josh Lerner and Nobel Prize Winner Jean Tirole). Dr. Strojwas has been with PDF Solutions for 15 years. During that time he has led DFM projects spanning all major foundries and several major fabless. He currently serves as General Manager of DFM Solutions. Previously, he held managerial roles in business development, strategy, and marketing.
David Tien is presently a Product Marketing Director in the Materials and Structural Analysis Division of Thermo Fisher Scientific. He has recently taken responsibility for the Wafer Dualbeam and SEM product lines within the physical failure analysis group of the semiconductor business unit. Prior to his new role, he was responsible for various electrical failure analysis product lines including Lock-in Thermography and Circuit Editing where he worked with failure analysis engineers on silicon and package level fault isolation as well as electrical failure analysis and repair of semiconductor devices. His experience in the semiconductor industry spans over two decades with experience not only in physical and electrical failure analysis but also in the areas of process development and process control and diagnostics. David holds a bachelor’s degree in Chemical Engineering from UC Berkeley and an MBA from California State University.
Paul A. W. van der Heide is the Director of the Materials and Component Analysis (MCA) Department at imec, in Leuven, Belgium. The scope of MCA is to a) support the characterization needs of imec (capabilities include APT, Raman, RBS, SIMS, SPM, TEM, XPS, …), and b) explore, develop and implement the characterization capabilities required for tomorrow’s industry. Prior to moving to imec, Paul held positions at GLOBALFOUNDRIES, Malta, NY, USA (where he headed the end-to-end analytical labs support for high volume semiconductor device manufacturing and R&D), Samsung, Austin, TX, USA (where he established and managed the surface characterization labs for supporting high volume device manufacturing), and the University of Houston, TX, USA (where he lectured in Physical Chemistry and Surface Analysis, while also managing the MRSEC SIMS-XPS facility). Paul earned a Ph.D. in Physical Chemistry from the University of Auckland, New Zealand (topic concerned the design and construction of a magnetic sector SIMS instrument), has authored over 150 publications in international peer reviewed journals, has presented ~20 invited and 2 plenary talks, and is sole author of two books published through Wiley.
Juliette van der Meer joined Bruker since 2008 as an Application Scientist for semiconductor X-ray applications. Currently she is a member of the X-ray business unit of the Nano Surfaces and Metrology Division and is the Product Marketing Manager for the automated XRD solutions for the semiconductor industry. In addition, she manages the collaborations between Bruker and EU partners in advanced technology projects. Juliette has a background in material science, with focus on thermodynamics. She obtained her Ph.D. at Utrecht University in the Netherlands. After that she did a postdoc in surface chemistry at the CNRS Marcoule, in France. It was during this project where she gained vast experience in X-ray techniques such as GIXRD and SAXS on mesoporous material.
She is based in Karlsruhe, Germany.
Yalin Xiong is Senior Vice President and General Manager of KLA-Tencor and oversees BBP Wafer Inspection Division and Reticle Products Division (RAPID). Dr. Xiong is responsible for all aspects of those two product lines including product strategy, marketing, technology, development, manufacturing, and sales. Dr. Xiong has been with KLA-Tencor for 21 years, starting as a Senior Engineer in the company’s RAPID division. Since joining KLA-Tencor, he has played various key roles in developing three consecutive generations of reticle inspection platform: SLF, 5xx and 6xx platform. In 2008, he was appointed Vice President of engineering in RAPID division. In 2012, he was appointed General Manager of RAPID division, responsible for all business related to reticle products. In early 2017, his responsibility is expanded to include the General Manager role for BBP Wafer Inspection Division. Prior to joining KLA-Tencor, he served as a Senior Member of Technical Staff at NASA’s Jet Propulsion Laboratory (1998 – 2000) and as a Senior Software Engineer with Apple Computer (1996 – 1998). Dr. Xiong has authored numerous technical papers in academic and industrial conferences and awarded numerous patents. He has presented technical solutions and served as a panelist in industry conferences and events. Dr. Xiong is a graduate from University of Science and Technology of China with a B.S. degree in computer science (1990) and holds Ph.D. in robotics from Carnegie Mellon University (1995).

Platinum Sponsors

Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
Logo Image
VIEW ALL

Gold Sponsors

Logo Image
Logo Image
Logo Image
Logo Image
VIEW ALL

Follow Us

Tweets by AVS_Members

Key Dates

Poster Abstract Submission Deadline:
December 15, 2021

Author Acceptance Notifications:
January 7, 2022

Early Registration Deadline:
May 2, 2022

Final Registration Deadline:
June 13, 2022

Hotel Reservation Deadline:
May 27, 2022

Downloads

  • FCMN 2022 Health & Safety Plan
  • Schedule
  • Sponsor Form
  • Presentation & Poster Guidelines

AVS
Della Miller

Event Manager
110 Yellowstone Dr. Suite 120
Chico, CA 95973
(530) 896-0477
della@avs.org

OverviewAbstractsHotel/TravelSponsors/ExhibitorsScheduleRegister
© 2020 AVS. All Rights Reserved.