FCMN 2022 Health & Safety Plan
To promote the safety of everyone attending FCMN 2022, we will monitor the guidance and requirements of the Centers for Disease Control (CDC), State of California, the California Department of Public Health, and the World Health Organization (WHO) regarding COVID-19 safety practices. Therefore, this Attendee Safety Plan may change from time to time through the last day of FCMN in June 2022.
The FCMN will bring together scientists and engineers interested in all aspects of the characterization technology needed for nanoelectronic materials and device research, development, integration, and manufacturing. All approaches are welcome: chemical, physical, electrical, magnetic, optical, in situ, and real-time control and monitoring. The semiconductor industry is evolving rapidly: the conference will highlight major issues and provide critical reviews of important materials and structure characterization and nearline/inline metrology methods, including hardware, data analysis, and AI and machine learning, as the industry both extends the technology deep into the nanoscale and increases the diversity of devices and systems.
The conference consists of formal invited presentation sessions and poster sessions for contributed papers. The poster papers cover new developments in materials and structure characterization/metrology down to the nanoscale. The conference began in 1995, and this meeting is the 13th in the series.
“There were a total of 34 talks and 81 poster presentations that summarized major issues and provided critical reviews of crucial semiconductor developments and techniques needed as the industry evolves to silicon nanoelectronics and beyond.”
-Alex Braun, “A Jaunt Through Nanotechnopolis,” Semiconductor International.
“If you want to meet, greet, and learn from the world‘s experts in metrology, this is the place to be.”
-Dan Hutcheson, The Chip Insider.
- J. Alexander Liddle, NIST
- Alain Diebold, CNSE, SUNY Polytechnic Institute
- Markus Kuhn, Rigaku
- Zhiyong Ma, Intel
- Paul van der Heide, IMEC
- Ofer Adan, Applied Materials
- Andy Antonelli, ONTO
- Jean-Paul Barnes, CEA-Leti
- Tomek Brozek, PDF Solutions
- Umberto Celano, Imec
- David Cooper, CEA-Leti
- David Fried, Lam Research
- Arosha Goonesekera, LaserTec Inc.
- Brian Gorman, Colorado School of Mines
- Sang Hyun Han, Nova
- Bjoern Hansson, Excillum
- Peter Hopkins, NIST
- Dan Hutcheson, TechInsights
- Rajiv Joshi, IBM
- Vimal Kamineni, PSIQuantum
- Joseph Kline, NIST
- Sylwia Kozdra, Łukasiewicz – IMiF
- Kristina Kutukova, Fraunhofer IKTS
- David Larson, Cameca Instruments, Inc.
- June Lau, NIST
- Jon Madsen, KLA Corporation
- Mathieu Munsch, Qnami
- Thomas Nuytten, Imec
- Christina Porter, ASML
- Olivier Renault, CEA-Leti
- Yu-Tsun Shao, Cornell University
- Marcin Strojwas, PDF Solutions
- David Tien, ThermoFisher
- Paul van der Heide, Imec
- Juliette van der Meer, Bruker
- Jeffrey Welser, IBM
- Yalin Xiong, KLA-Tencor
- WenBing Yun, Sigray